Commissariat à l'énergie atomique et aux énergies alternatives
CEA LIST is one of the three institutes forming the Technological Research Direction at CEA, The French Alternative Energies and Atomic Energy Commission. Its vocation is to help companies to increase their competitiveness by technological innovation and to transfer its technical knowhow to industry. Its activities cover a wide range of fields, from advanced software development, artificial intelligence, additive manufacturing, sensors and signal processing, embedded systems, robotics, to more specific domains such as radiation dose metrology, radiotherapy or cybersecurity.
The department of imaging and simulation for non-destructive testing (DISC) has an extensive experience in the NDT/NDE field with the three main techniques: ultrasound testing, eddy current testing and X-ray imaging. The department develops the CIVA software (http://www-civa.cea.fr), a platform for modelling and simulation (UT, ET, RT, CT), recognized worldwide as the state-of-the art simulation tool. Advanced inspection methods are being developed, mostly specifically designed for industrial needs through direct collaborations with industrials, or through institutional collaborations. Developments of new inspection instruments is also at the core of the department and innovative devices are proposed through spin-off companies.
In the field of X-ray imaging, the department has an experience of more than 20 years and is equipped with several X-ray CT systems with various sources, from a nano-focus device to high energy imaging in the MeV range. CEA LIST recently developed a fully equipped robotized tomographic platform, which consists of two robotic arms carrying an X-ray microfocus source and a 2D detector. This robotic configuration of high flexibility in the acquisition trajectory allows for new and improved inspection strategies.
CEA LIST will lead work package 3, focusing on the design, implementation, test and validation of the software tool for the focal spot size measurement. It will also be involved in work packages 4, 5 and 6.