Logo der Physikalisch-Technischen Bundesanstalt

Übersichtsartikel: Quantitative Mikroskopie und dimensionale Nanometrologie

Publikations Einzelansicht

Beitrag zu Tagungsband

Titel: Aspects and new developments on edge angle and edge profile metrology at PTB
Autor(en): B. Bodermann, E. Buhr, A. Diener, K. Dirscherl, G. Ehret, C. G. Frase, M. Wurm
Journal: Metrology, inspection, and process control for microlithography XXI
Jahr: 2007
Buchtitel: Proceedings of SPIE
Band: 6518
Seite(n): 65181X-1 - 65181X-11
Verlag: Bellingham, Wash.: SPIE
Veranstaltungsname: Advanced Lithography 2007
Veranstaltungsort: San Jose, USA
Veranstaltungsdatum: 25, February - 02, March, 2007
ISBN: 978-0-8194-6637-2
Datei / URL: proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=1300183
Zusammenfassung: Measurement and control of edge profiles and edge angles is increasingly important in advanced lithography. Especially for critical dimension metrology a sophisticated multi-dimensional shape metrology is highly beneficial. Different types of dimensional metrology instrumentation are in use today for edge profile and edge angle measurement. While destructive cross section SEM measurements often serve as reference, AFM and optical scatterometry systems are commonly used for day-to-day or in-line control. Due to the limitations of these metrology systems (AFM: slow, scatterometry: only integral measurements of periodic structures), the evaluation and modelling of top down SEM images is increasingly considered, too.At the PTB both SEM and AFM as well as optical scatterometry are applied for edge angle and/or edge profile metrology, supported by optical transmission microscopy. At the PTB we have realised a new DUV hybrid scatterometer for measurements over the full range of 6025 format masks which combines essential elements of a reflectometer, an ellipsometer, and a diffractometer. In addition to scatterometric measurements this set-up allows to measure the complete Müller-matrix including transmission, polarisation and depolarisation. This new set-up will be presented in detail. Finally we study the possibilities of evaluating high resolution top down SEM images to determine edge angles. The potential of edge angle evaluation using these new analysis procedures will be discussed. We present an overview of the PTB measurement capabilities with an emphasis on newly developed metrology methods and systems.

Zurück zur Listen Ansicht