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Production sequence of Si-spheres and interferometrical determination of the sphere volume

Laser processing

For laser processing are two pulsed sources with the wavelength 355 nm at 4 W and 1062 nm at 20 W available. An extensive robotics opens up a wide field of micro-machining capabilities.

Our self-developed kinematics with currently 4 axes for UV and also another 4-axis machining system for IR allow extensive processing tasks to complex geometries. The cutting, structuring and marking of virtually all materials and the exposure of photolithographic processes are possible.

4-axis robot with a UV laser
to the external machining
of a cylindrical component
UV-laser deflection, and
robotics to the inner
Textured interior, gold-plated

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