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Production sequence of Si-spheres and interferometrical determination of the sphere volume

3D Nanometrology

Working Group 5.23

Profile

Working group 5.23 focuses on research and development of reference three-dimensional (3D) nanometrology of complex nanostructures, including the measurements of feature width (CD), height, edge profile, sidewall angle (SWA), corner rounding, footing, contour and line edge/width roughness (LER/LWR). Such reference 3D nanometrology  ensures the traceability and accuracy of various on- and off-line nano measurement tools such as optical scatterometry, atomic force microscopy (AFM) and scanning electron microscopy (SEM), thus ensure reliable nanomanufacturing.
The main research field of the working group concerns the advanced Scanning Probe Microscopic (SPM) technique, e.g., high-speed metrological large-range Atomic Force Microscopy (AFM) and 3D/CD-AFM. Multidisciplinary technologies such as electron microscopy (FIB, SEM and HR-TEM), optical 3D microscopy (confocal, phase shift interference and white light interference microscopy), data fusion and hybrid metrology are intensively involved.
Our research tasks include the development of advanced metrology techniques and tools, traceability routes, physical and documentary standards, measurement and calibration strategies, data evaluation algorithms and software, etc.
With the advanced 3D nanometrology technologies and facilities, we are offering versatile 3D nanometrology services to customers from all over the word at the highest accuracy level.

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Research/Development

Our main research focus includes:

  • Research of advanced 3D nanometrology techniques for better accuracy, faster speed, larger scan range and better 3D capability;
  • Development of nanoscale standards, particularly a new CD standard type IVPS100-PPTB (collaborated with the Team-Nanotec company), and a new circular chirp standard for characterising the ITF (instrument transfer function) of areal surface measuring tools;
  • Development of a new traceability route via crystal silicon lattice for 3D nanometrology with assistance of FIB and (S)TEM technique;
  • Development of software and algorithms for nanoscale dimensional metrology, data fusion and hybrid metrology;
  • Understanding and modelling of the tip-sample interaction
  • Documentary standardisation activities
  • Versatile 3D nanometrology calibration services with the highest-level accuracy for customers from all over the word.

Please refer to the items listed in the information panel for details.

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Services

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Information

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