Helmholtz-seminar 2023: NanoScale October 10th to 12th, 2023 in Helsinki

After a 4-year break due to the pandemic, NanoScale took place again in October 2023, this time in the modern conference center Technopolis Ruoholahti in Helsinki, Finland. With 106 participants from 24 countries, the 9th edition of the NanoScale was once again very well received and significantly exceeded the organizational team's expectations – which were somewhat cautious after the pandemic. Many conference guests were pleased to be able to finally meet their colleagues from Europe and all over the world in person again after the pandemic and exchange ideas with them. In addition to guests from 15 European countries, we were able to also welcome experts from Australia (NMIA), Japan (NMIJ), USA (NIST), Korea (KRISS), Taiwan (ITRI) and South Africa (NMISA).

NanoScale 2023, which also runs as permanent EURAMET project #1342 under the leadership of Uwe Brand, was organized by a local team led by Virpi Korpelainen from the Finnish Metrology Institute VTT MIKES together with the PTB team led by Thorsten Dziomba (PTB 5.1) with support through the Helmholtz Fund. The oral presentations were selected by a 12-member International Scientific Committee. A total of 31 lectures and 52 posters were presented.

The conference proceedings are published in a virtual Special Section of Measurement Science and Technology (MST) . The first papers have already been accepted for publication and are already linked there, and further papers will be added in summer 2024 once they will have completed peer-review.

Development of a New Probetip Characterizer

In cooperation with Department 5.2 Dimensional Nanometrology a material measure of silicon with grooves of very sharp rectangular edges has been developed to measure the tip radius of tactile probes. Radius and shape of probe tips can either be determined by the tip's entrance depth into the grooves of varying width or by analysing the transfer characteristics of the edge transitions.

The Department Surface Metrology conducts industry-related research and development on tactile and optical surface texture measurement methods with the aim of being able to use optical measuring microscopes to use for roughness measurements in the future. In addition, new calibration standards based on silicon crystals and new measurement methods using micro-electro-mechanical systems (MEMS) are being developed.

The department is responsible for the calibration

• of roughness standards and depth setting standards up to a depth of 5 mm
• the layer thickness
• of hardness reference plates and
• the bending stiffness of AFM cantilevers and reference springs.

The department

• participates in the development of standards and guidelines for surface metrology, both at the international level in ISO/TC 213 and IMEKO and in national committees of DIN, VDI and DKD
• conducts and supports the development of standards and test specimens in the field of surface metrology, i.e. for tactile, optical and atomic force microscopy methods as well as for hardness and coating thickness metrology
• is active in the field of research and development of new measuring instruments and measuring methods as well as algorithms for the analysis of data and the modelling of measuring methods.

Mono-atomic step-height standards

Processing procedure and measurement capabilities on mono-atomic steps on otherwise atomically smooth Si surfaces. Scientific news

optical roughness metrology

Development of guidelines for the configuration of optical surface measuring instruments for the measurement of roughness Scientific news

Tactile Micro-Electro-Mechanical Systems (MEMS)

Development of measurement methods for measuring the dynamic mechanical characteristics of surfaces. Scientific news

Software developement for roughness parameter determination

Development of software for determination of the roughness parameters from surface measurements.