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X-ray analysis for 450 mm wafers

PTB-News 1.2015
Especially interesting for
  • semiconductor manufacturers
  • manufacturers of X-ray test equipment

The introduction of the 450 mm technology for wafer production and the further scaling-down of critical dimensions require improved X-ray analytical methods. PTB has therefore designed a complementary metrology chamber to characterize 450 mm wafers; its core component is a multi-axis manipulator whose patent is pending. By spatially stacking all mobile components, this chamber allows several X-ray methods, which are indispensable in the production process of wafers to analyse defects, to be integrated into the smallest possible volume. (Technology offer #307)

  • comprehensive 450 mm wafer characterization in one tool with a 1 m2 footprint
  • 2D scanning
  • adjustment of the crystal orientation at any wafer location
  • maximum reliability and reproducibility

Contact person for questions about technology transfer

Andreas Barthel,
Phone: +49 (0)531 592-8307,
Opens window for sending emailandreas.barthel(at)ptb.de,
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