Towards ever larger wafers

28.09.2010

Components of micro- and nanoelectronics are manufactured on silicon wafers. In the past few decades, their diameter has increased from a few millimeters to meanwhile 300 mm. After the manufacture had been established at this stage, the next step towards an increase in productivity has now been tackled worldwide. The Physikalisch-Technische Bundesanstalt (PTB) is one of ten German partners in a European multisectoral project which investigates the manufacture on wafers 450 mm in diameter. With these, the area available for components is more than doubled. This will lead to a significant increase in the yield and, thus, to a decrease in the manufacturing costs.

Contact:
Dr. Burkhard Beckhoff,
PTB Working Group 7.12 X-ray Spectometry,
Telephone: +49 (0) 030 6392-5091,
e-mail: burkhard.beckhoff(at)ptb.de

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Contact

Erika Schow

Phone: +49 531 592-9314
Email:
erika.schow(at)ptb.de

Imke Frischmuth

Phone: +49 531 592-9323
Email:
imke.frischmuth(at)ptb.de

Secretariat

Karin Conring

Phone: +49 531 592-3006
Fax: +49 531 592-3008
Email:
karin.conring(at)ptb.de

Address

Physikalisch-Technische Bundesanstalt
Bundesallee 100
38116 Braunschweig

Towards ever larger wafers

European multisectoral project investigates the next generation of wafers 450 mm in diameter