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Towards ever larger wafers

European multisectoral project investigates the next generation of wafers 450 mm in diameter


Components of micro- and nanoelectronics are manufactured on silicon wafers. In the past few decades, their diameter has increased from a few millimeters to meanwhile 300 mm. After the manufacture had been established at this stage, the next step towards an increase in productivity has now been tackled worldwide. The Physikalisch-Technische Bundesanstalt (PTB) is one of ten German partners in a European multisectoral project which investigates the manufacture on wafers 450 mm in diameter. With these, the area available for components is more than doubled. This will lead to a significant increase in the yield and, thus, to a decrease in the manufacturing costs.

Dr. Burkhard Beckhoff,
PTB Working Group 7.12 X-ray Spectometry,
Telephone: +49 (0) 030 6392-5091,
e-mail: burkhard.beckhoff(at)ptb.de