XRF and TXRF Instrumentation

PTB operates dedicated XRF and TXRF instrumentation at its PGM-U49 beamline for various applications ranging from wafer surface contamination analysis over fundamental atomic parameter determinations to nanolayer characterisations.
images/xrfinstrumentation01.jpg

XRF and TXRF Instrumentation at the PGM-U49 beamline

Wafer size: 200 mm (8”) Si wafer and 300 mm (12”) Si wafer
Detection geometry: 45° observation viz. detection angle
Grazing incidence angle (Φ): 0° to 45°, resolution 0.001°, allowing TXRF, GIXRF and XRF
Sample translation: > 150 mm vertical (┴ to beam direction)
Sample rotation: ± 200°, thus the whole wafer surface is accessible
Si(Li) detector for (T)XRF: energy resolution 89 eV to 138 eV with increasing photon energy,
distance to sample surface ranges from 5 mm to 200 mm
Additional (T)XRF detector: windowless silicon drift detector, high count-rate capability for
NEXAFS studies

Table 1    Operational parameters of PTB's installation for (T)XRF analysis on 200 mm and 300 mm Si wafers.

Sample size: up to 75 mm (standard sizes 5 mm, 10 mm, 15 mm to 30 mm, 50 mm)
Standard XRF geometry: 45°; incidence angle and 45° observation viz. detection angle
Grazing incidence angle (Φ): 0° to 5°, resolution 0.01°, beam geometry for TXRF and GIXRF experiments
Sample translations: 100 mm horizontal (┴ to beam direction),
± 17 mm vertical (┴ to beam direction)

Table 2    Operational parameters of PTB's reference-free XRF instrumentation.

Photon energy range: 78 eV to 1860 eV, thus including the Si-L and K absorption edges
Photon flux: up to 1012 s-1
Resolving power: ranging from 103 to 104 depending on the photon energy, on the exit
slit size (0.04 mm to 0.6 mm) and on the selected Cff parameter
High spectral purity,
higher order contributions:
< 10-2
Spot size: 0.14 mm horizontally and 0.04 mm to 0.6 mm vertically

Table 3    Operational parameters of the PGM-U49 beamline.

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last update: 2011-09-30
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