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Working Group 5.11

Nanoforce Metrology for Tactile Sensors


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Standards and Guidelines

Overview  Symbol für Gehezu (VDI Richtl & DIN Normen.pdf)

DIN Standard committee 027-03-03 AA Symbol Gehezu "Workshop Facilities for Microsystems"

In this committee (chairman: Dr. U. Gengenbach) standards for workshop facilities for the production of microsystems are developed.
The standards project "Metrology and Quality Assurance in MST" is concerned with

  • Determination of material influence on measurement uncertainty in the optical and tactile dimensional metrology

VDI/VDE-GMA technical committees

In the VDI/VDE society for Measurement- and Automation-technology the department 3.40 (chairman: Prof. Weckenmann) is concerned with Symbol für Gehezu Metrology in the Micro- and Nanotechnology .

Technical Committee 3.41/3

The technical committees 3.41 and 3.43 are concentrated on geometrical measurement categories, standards and calibrations. Chairmen of these jointly meeting committees are Günter Wilkening (PTB) and M. Krauss (Bosch). Meetings take place twice a year. The following topics are processed at the moment:

  • guideline VDI/VDE 2655 "Calibration of optical roughness measuring instruments"
    page 1 "Interference microscopes and roughness measurements; calibration of measurement systems and depth setting standards". 
  • guideline "Calibration of scanning probe microscopes"
  • guideline "Form-metrology with optical instruments"

Technical Committee 3.44

The technical committee 3.44 "Dimensional Metrology" (chairman: Prof. Gerd Jäger, TU Ilmenau) is concerned with:

  • multi-coordinate nanometrology and nano-positioning techniques
  • 3d-nano-probing systems
  • multi-functional cantilever-metrology
  • calibration of nano-positioning and nano-measuring systems
  • uncertainty analysis
  • evaluation of probing systems
  • 3d-standards

Technical Committee 3.42

The technical committee 3.42 "Non-geometrical measurement categories" chaired by Dr. Georg Reiners (BAM). Main topics are "Chemical composition (analytical TEM (ATEM), energy filtered TEM (EFTEM), AES, ESCA, TOF-SIMS, SNMS, GDOES, ...)", crystallografic structure (GIXE, HRTEM, ...), mechanical properties (nanoindentation, SAW, Scratch-Test, ...) and physical properties.

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