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Nanometrology on gratings with GISAXS: FEM reconstruction and Fourier analysis

Author(s): V. Soltwisch, J. Wernecke, A. Haase, J. Probst, M. Schoengen, M. Krumrey and F. Scholze
Journal: Proc. SPIE 9050
Year: 2014
Month: April
Day: 2
Event name: Metrology, Inspection, and Process Control for Microlithography XXVIII
Event place: San Jose, California, United States
Event date: February 23, 2014
DOI: 10.1117/12.2046212
Abstract: The aim of the semiconductor industry to decrease the feature size of integrated circuits poses a huge technological endeavor. Consequently, new challenges are arising for metrology on structures in the nanometer regime. Scatterometry is a fast method which provides non-contact non-destructive characterization of structures on photomasks or exposed wafers. However, the determination of important line structure parameters with subnanometer accuracy still needs further investigation. Grazing incidence small-angle X-ray scattering (GISAXS) is a scatterometry technique to measure both vertical and lateral structural features in the nanometer range with high sensitivity. We apply GISAXS to the investigation of structural parameters such as period length, sidewall angle, linewidth and height on silicon gratings. Our test structures with nominal widths of 35 nm to 100 nm and a pitch from 100 nm to 250 nm were fabricated by electron beam lithography. The diffraction patterns have been analyzed by power spectral density analysis which directly yields periodical modulations of the structured surface such as line width or groove width. We also apply a finite element method (FEM) to the diffraction peak intensity of the grating structure obtained with GISAXS for the geometric reconstruction of the line shape. © (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

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